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DATA SHEET
SKY77182 Power Amplifier Module for WCDMA / HSDPA (1920-1980 MHz)
Applications
* WCDMA Handsets * HSDPA Handsets * Personal Communications Services (PCS) * Wireless local loop (WLL)
Description
The SKY77182 Power Amplifier module is a fully matched 8-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 1920-1980 MHz bandwidth into a single compact package. The SKY77182 meets the stringent spectral linearity requirements of HSDPA (High Speed Downlink Packet Access) data transmission with high power added efficiency for power output of up to 28 dBm. Because of high efficiencies attained throughout the entire power range, the SKY77182 delivers unsurpassed talk-time advantages. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC includes on-board bias circuitry, as well as input and interstage matching circuits. The output match is realized off-chip within the module package to optimize efficiency and power performance into a 50 load. This device is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77182 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.1 to 4.6 volt range. No VREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zero volts. Digital bias control can be used to optimize efficiency at high and low power or analog bias control can be used to optimize efficiency over the entire power range. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* No VREF required * Low voltage positive bias - 3.1 V to 4.6 V * Supports low collector voltage operation * Good linearity * High efficiency at all power levels (17% at 15 dBm) * Large dynamic range * Low Profile package - 3 mm x 3 mm x 0.9 mm * 8-pad configuration * Power down control * InGaP * Digital VENABLE * Digital or Analog VCONTROL
MODULE
VCC (5)
MMIC
RF_IN (3)
INPUT MATCH
DA
INTERSTAGE MATCH
PA
OUTPUT MATCH
(6) RF_OUT
VEN (1) VCONT (2) VBIAS (4)
BIAS and GAIN CONTROL CIRCUIT
GND (7, 8)
200850_001
Figure 1. SKY77182 Functional Block Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200850A * Skyworks Proprietary and Confidential Information. * Products and product Information are subject to change without notice. * February 14, 2008
1
DATA SHEET
SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz)
Electrical Specifications
The following tables list the electrical characteristics of the SKY77182 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve the performance characteristics for WCDMA and HSDPA listed, respectively, in Table 3 and
Table 5. Standard test configurations for WCDMA and HSDPA are shown in Table 4 and Table 6, respectively. Table 7 specifies the recommended control and collector voltages vs. output power for low collector voltage operation.
Table 1. Absolute Maximum Ratings 1
Parameter RF Input Power Supply Voltage Control Voltage Enable Voltage Case Temperature Ruggedness - no damage 2 Operating Storage PIN VCC, VBIAS VCONT VEN TCASE TSTG Ru Symbol Minimum -- -- 0 -- -30 -55 -- Maximum 8.0 6.0 1.5 3.0 110 125 10:1 VSWR Unit dBm Volts Volts Volts C
1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. 2 PO_MAX, all phases, time = 10 sec, continuous modulated signal.
Table 2. Recommended Operating Conditions
Parameter RF Output Power Operating Frequency Supply Voltage 1 Bias Voltage Enable Voltage PA On PA Off VCONTROL Range Load Mismatch (all angles) Case Operating Temperature
1 When VCC supply is 3.4 V, PO_MAX must be backed off 0.5 dB.
Symbol WCDMA HSDPA FO VBATT DC/DC VBIAS VEN VCC PO_MAX
Minimum -- -- 1920 3.1 1.5 3.4 0.8 0.0
Nominal -- -- 1950 3.4 3.4 3.4 1.1 -- 1.0 1.0 25
Maximum 28 27 1980 4.6 3.4 4.6 2.0 0.5 1.0 -- 85
Unit dBm MHz Volts Volts Volts
High Power Range
VCONT VSWR TCASE
0.5 -- -20
Volts VSWR C
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SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz) Table 3. SKY77182 Electrical Specifications for WCDMA -- Recommended Operating Conditions 1 Refer to Table 4. Standard Test Configuration -- WCDMA Voice Mode (Uplink Reference Measurement Channel: 12.2 kbps)
Characteristics Symbol Condition Minimum Typical Maximum
DATA SHEET
Unit
High Power Gain Conditions Low Power
GHIGH
PO_MAX
26.0
31.0
34.0 dB
GLOW
VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm TCASE = 25 C --
24.0
27.5
31.0
Gain Variation Over Frequency High Power Power Added Efficiency @ VCC = 3.4 V Low Power Error Vector Magnitude PAELOW EVM ACLR1_H 5 MHz offset ACPR1_L Adjacent Channel Leakage power Ratio 2 10 MHz offset ACLR2_L Second Harmonic Suppression Third fL3 PN_GSM_II PN_GPS PN_PHS Noise Power 3 PN_DCS PN_WRX PN_WRX2 PN_BT Noise Figure Input Voltage Standing Wave Ratio (VSWR) Stability Quiescent Current Control Current Enable Current Leakage Current NF VSWR S ICQ_H ICONT IEN ILEAK fH2 ACLR2_H PO_MAX PAEHIGH
-- 35.0
-- 39.0
1.5 --
dB
PO_MAX TCASE = 25 C VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm --
% 14.0 -- -- -- -- -- -- 18.5 2 -40.0 -42.0 -53.0 -65.0 -48 -58 -- -- -- -- -- -- -- -- 1.5 -- 65 -- -- 10 -- 3 -36.0 -38.0 dBc -48.0 -53.0 -43 dBc -- -53 -95 -90 -53 -83 -93 -70 -80 5 2.0 -65 -- 200 5 12 dB -- dBc mA A A A dBm/30 kHz -- -- -- -- -- -- -- -- -- -- -- -- -- -- %
VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm PO_MAX VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm VCC = 3.4 V 875 to 925 MHz 1570 to 1580 MHz 1893.5 to 1919.6 MHz 1805 to 1880 MHz 2110 to 2170 MHz RX = 2110 MHz TX = 1980 MHz 2400 to 2480 MHz -- -- VSWR = 6:1 VCC = 3.4 V VCONT = 1.0 V -- VEN 1.0 V VREF = off VEN = off
1 Per Table 2, unless otherwise specified. Data in Table 3 were verified with the WCDMA test configuration shown in Table 4. 2 ACLR is specified per 3GPP as the ratio of total in-band power to adjacent power, both measured in 3.84 MHz bandwidth at specified offsets. 3 PO 27.5 dBm
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200850A * Skyworks Proprietary and Confidential Information. * Products and product Information are subject to change without notice. * February 14, 2008
3
DATA SHEET
SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz)
Table 4. Standard Test Configuration -- WCDMA Voice Mode (Uplink Reference Measurement Channel: 12.2 kbps)
Parameter Information Bit Rate DPCCH DPDCH TFCI Level 12.2 kbps 15.0 kbps 60.0 kbps On Spread Code -- 0 16 -- Spread Factor -- 256 64 -- I/Q -- Q I -- c -- 8/15 -- -- d -- -- 15/15 -- hs -- -- -- -- Relative Power -- -6.547 dB -1.087 dB --
Table 5. SKY77182 Electrical Specifications for HSPDA -- Recommended Operating Conditions 1 Refer to Table 6. Standard Test Configuration -- HSDPA Mode
Characteristics Symbol Condition Minimum Typical Maximum Unit
High Power Gain Conditions Low Power
GHIGH
PO_MAX
26.0
31.0
34.0 dB
GLOW
VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm TCASE = 25 C --
24.0
27.5
31.0
Gain Variation Over Frequency High Power Power Added Efficiency @ VCC = 3.4 V Low Power PAELOW PAEHIGH PO_MAX
-- 33.0
-- 35.5
1.5 --
dB
% VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm -- 15.0 19.0 --
Error Vector Magnitude
EVM
--
2
3
%
ACLR1_H 5 MHz offset ACLR1_L Adjacent Channel Leakage power Ratio 2 ACLR2_H 10 MHz offset ACLR2_L
PO_MAX VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm PO_MAX VCC = 1.6 V VCONT = 0.8 V PO = 16 dBm
--
-38
-36
--
-48
-38 dBc
--
-53
-46
--
-60
-53
1 Per Table 2, unless otherwise specified. Data in Table 5 were verified with the HSDPA test configuration shown in Table 6. 2 ACLR is specified per 3GPP as the ratio of in-band power to adjacent power, both measured in 3.84 MHz bandwidth at specified offsets.
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SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz) Table 6. Standard Test Configuration -- HSDPA Mode
Parameter DPCCH DPDCH HS- DPDCH TFCI Level 15 kbps 60 kbps 15 kbps On Spread Code 0 16 64 -- Spread Factor 256 64 256 -- I/Q Q I Q -- c 12/15 -- -- -- -- d -- 15/15 hs -- -- 24/15 --
DATA SHEET
Relative Power -8.17 dB -6.23 dB -2.15 dB --
Table 7. Recommended Controls for Low Collector Voltage Operation
PSET WCDMA -10.0 0.0 5.0 9.0 13.0 15.0 16.0 17.0 18.0 20.0 23.0 24.0 25.0 26.0 27.0 27.5 28.0 27.5 PSET HSDPA -10.0 0.0 5.0 9.0 13.0 15.0 16.0 17.0 18.0 20.0 23.0 24.0 25.0 26.0 26.5 27.0 -- 27.0 VCONT 0.50 0.50 0.50 0.60 0.70 0.75 0.80 0.80 0.85 0.90 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 VCC 1.5 1.5 1.5 1.5 1.5 1.5 1.6 1.7 1.8 2.0 2.3 2.6 2.8 3.0 3.1 3.4 3.4 4.6 VEN 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 VBIAS 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 4.6
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200850A * Skyworks Proprietary and Confidential Information. * Products and product Information are subject to change without notice. * February 14, 2008
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DATA SHEET
SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77182, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 2 shows the basic schematic of the board for the 1920 MHz to 1980 MHz range.
Figure 2. Evaluation Board Schematic
Figure 3. Evaluation Board Assembly Diagram
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SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz)
DATA SHEET
Package Dimensions and Pad Descriptions
The SKY77182 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 4 is a mechanical drawing of the pad layout for this package. Figure 5 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. Figure 6 shows the pad names and the pad numbering convention, which starts with pad 1 at the upper left, and increments counterclockwise around the package. Figure 7 illustrates typical case markings.
8X 1.4
2X 0.7
PAD 1 LOCATOR
3
B C 0 PAD 1 ID 0.2 X 0.2
4X 1.2
A
3 0 4X 0.4
B
2X 1.325 A 0.05 A B C 0.9 0.1 0.1 3X R0.2 4X 1.4 8X SMT PAD 0.1 M A B C SOLDER MASK OPENING 0.15 A B C
TOP VIEW SIDE VIEW
METAL PAD EDGE
BOTTOM VIEW
METAL PAD EDGE 0.4 0.075 (0.1) 0.4 0.03
0.4 0.03 0.4 0.075 (0.2)
DETAIL SMT PAD SCALE: 2X 2X THIS ROTATION 2X ROTATED 180 1X 1X 1X 1X
A
(0.2)
DETAIL SMT PAD SCALE: 2X THIS ROTATION ROTATED 180 ROTATED 90 CW ROTATED 90 CCW
B
NOTES: Unless otherwise specified 1. DIMENSIONING AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994. 2. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT. 3. PADS ARE SOLDER MASK DEFINED ON ALL INSIDE EDGES. 4. ALL DIMENSIONS ARE IN MILLIMETERS.
200850_004
Figure 4. Drawing for 3 mm x 3 mm x 0.9 mm, 8-pad Package - SKY77182 (All Views)
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DATA SHEET
SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz)
0.6
0.6
0.4
0.4 0.2
2.1
0.8 TYP
0.8 TYP
0.7
1.1 3 3.2 Component Outline Component Outline 1.1 3 3.2
STENCIL APERTURE
TOP VIEW APPROACH 1
STENCIL APERTURE
TOP VIEW APPROACH 2
0.6
Common Ground Pad
Component Outline
Component Outline
0.7
1.4
0.4
0.5
2.65
0.8 TYP
0.8 TYP
Thermal Via Array
O0.3 mm on 0.5 mm Pitch Additional vias will improve thermal performance. NOTE: Thermal Vias should be tented and filled with solder mask 30-35 m Cu plating recommended
3 3.3
0.25 3 3.2
SOLDER MASK OPENING
TOP VIEW ALL DIMENSIONS IN MILLIMETERS
200565_005
METALLIZATION
TOP VIEW
Figure 5. Phone PCB Layout Footprint for 3 x 3 x 0.9 mm, 8-pad Package - SKY77182
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SKY77182 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA (1920-1980 MHz)
DATA SHEET
VEN
1
8
GND
VCONT
2
7
GND
RF_IN
3
6
RF_OUT
maximum temperature should not exceed 260 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 260 C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information - RF Modules, Document Number 101568.
VBIAS
4
GROUND PAD
5
VCC
Pad layout as seen from top view looking through the package. 200850_005 GROUND PAD is package underside.
Electrostatic Discharge Sensitivity
The SKY77182 is a Class 1 device. Figure 8 lists the Electrostatic Discharge (ESD) immunity level for each non-ground pad of the SKY77182 product. The numbers in Figure 8 specify the ESD threshold level for each pad where the I-V curve between the pad and ground starts to show degradation. ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pad, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization.
VEN
> + 1.25 kV < - 1.25 kV
Figure 6. SKY77182 Pad Names and Configuration
Pad 1 Identifier
Line 1 PART NUMBER -- VERSION Line 2 LOT NUMBER Line 3 YEAR WEEK COUNTRY CODE
1
8
GND
VCONT
NOTE: SKY77182 Lines 1, 2, 3 have a maximum of 7 characters YEAR = Year of Manufacture WEEK = Week Package Was Sealed Country Code = Country of Manufacture (MX)
> + 1.25 kV < - 1.25 kV
2
7
GND
200850_007
RF_IN
> + 1.25 kV < - 1.25 kV
3
6
RF_OUT
> + 1.25 kV < - 1.25 kV
Figure 7. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77182 is capable of withstanding an MSL3/260 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second;
VBIAS
> + 1.25 kV < - 1.25 kV
4
GROUND PAD
5
VCC
> + 1.25 kV < - 1.25 kV
200850_008
Pad layout as seen from top view looking through package.
Figure 8. SKY77182 ESD Sensitivity Areas
Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pad fails the electrical specification limits" or "the pad becomes completely nonfunctional". Skyworks employs most stringent criteria, fails devices as soon as the pad begins to show any degradation on a curve tracer.
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ADVANCE DATA SHEET * SKY77182
POWER AMPLIFIER MODULE FOR WCDMA (1920-1980 MHz)
To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class 1 ESD * Personnel Grounding - Wrist Straps - Conductive Smocks, Gloves and Finger Cots - Antistatic ID Badges * Protective Workstation - Dissipative Table Top - Protective Test Equipment (Properly Grounded) - Grounded Tip Soldering Irons - Solder Conductive Suckers - Static Sensors
handling precautions listed below.
* Facility - Relative Humidity Control and Air Ionizers - Dissipative Floors (less than 109 to GND) * Protective Packaging and Transportation - Bags and Pouches (Faraday Shield) - Protective Tote Boxes (Conductive Static Shielding) - Protective Trays - Grounded Carts - Protective Work Order Holders
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Ordering Information
Model Number SKY77182 Manufacturing Part Number SKY77182 Product Revision Package MCM3x3LM-8 Operating Temperature -20 C to 85 C
Revision History
Revision A Level Date February 14, 2008 Initial Release Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel Information - RF Modules, Document Number 101568 Standard SMTP Reflow Profiles: JEDEC Standard J-STD-020
(c) 2008, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS(R) PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks(R) products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks(R) products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks(R), the Skyworks symbol, and "Breakthrough Simplicity"(R). Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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